Improving properties of fungal materials

Abstract

Mycelium plugs of Schizophyllum commune showed a stress response after interacting with Trichoderma aggressivum or Trichoderma harzianum. Colonies of S. commune cover less surface area after these interactions than after control conditions. However, no directional growth was observed for S. commune colonies after interacting with T. aggressivum and T. harzianum. The attempts to create a self-healing gypsum-fungus composite did not succeed. However, macerated S. commune mycelium in between two gypsum blocks was able to cohere these blocks together. This could potentially be used to heal cracks in building materials. Finally, growing S. commune in liquid cultures under different conditions (growth media, temperature, and shaking speed) resulted in different morphologies. Material properties that resulted from these morphologies ranged from 0,44 MPa to 13,13 MPa and 7,99 MPa to 1150,30 MPa for ultimate tensile strength and Young’s modulus, respectively. The properties of fungal materials produced in this study are similar to rubbers, polymers, bioplastics, and leathers, but some are also similar to wood products. This range in properties indicates that fungal materials can be used to replace a range of conventional materials.